Electrical component with a dielectric passivation stack
US11482449B2 · kind B2 · utility
0Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2020 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Aug 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1904
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical component and method for manufacturing the electrical component with a substrate a conductor stack having multiple layers and including at least one electrically conductive path. The conductor stack mounted to the substrate with a dielectric passivation stack encasing at least a portion of the conductor stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.