Semiconductor device and method for manufacturing semiconductor device
US11482555B2 · kind B2 · utility
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10Claims
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Assignee
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Key dates
| Filing date | Nov 27, 2018 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Nov 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a support body including a mount region, a semiconductor chip disposed on the mount region with a predetermined distance therebetween, a bump disposed between the support body and the semiconductor chip, a wall portion disposed between the support body and the semiconductor chip along a part of an outer edge of the semiconductor chip, and an underfill resin layer disposed between the support body and the semiconductor chip. The underfill resin layer covers an outer side surface of the wall portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.