Substrate and manufacturing method thereof and electronic device
US11482592B2 · kind B2 · utility
0Cited by
15References
18Claims
0Family size
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Key dates
| Filing date | Oct 26, 2018 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Jan 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate, a manufacturing method of a substrate and an electronic device are provided. The substrate includes a working region, a non-working region surrounding the working region, a base substrate, a peripheral circuit and a common electrode lead both in the non-working region and on the substrate; the common electrode lead is located on a side of the peripheral circuit close to the working region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.