Semiconductor device and fabrication method thereof
US11482603B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Sep 18, 2020 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Sep 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/834
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device and a method for forming the semiconductor device are provided. The method includes providing a substrate; forming a fin on the substrate, where the substrate includes a fin dense region and a fin sparse region; forming a gate structure across the fin over the substrate; forming a source-drain doped layer in the fin on both sides of the gate structure; forming a dielectric layer over the substrate, where the dielectric layer covers a top of the gate structure; and forming a first through-hole in the dielectric layer on a side of the gate structure in the fin sparse region, where a bottom of the first through-hole exposes a top sidewall of the gate structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.