Packaging method, electronic device, and packaging apparatus
US11482689B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 6, 2018 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Jul 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/873
Abstract
Embodiments of the present disclosure provide a packaging method, an electronic device, and a packaging apparatus. The packaging method includes: providing a first substrate and a second substrate; and cell-assembling the first substrate and the second substrate to sandwich a filling glue between the first substrate and the second substrate to form a packaging structure, the filling glue is mixed with electrophoretic liquid encapsulated by a capsule, and the electrophoretic liquid includes an electrophoretic particle; in a process of cell-assembling the first substrate and the second substrate, applying an electric field to control the electrophoretic particle to move directionally to deform the capsule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.