Laminated component carrier with a thermoplastic structure
US11483923B2 · kind B2 · utility
2Cited by
11References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2017 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Mar 30, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.