Systems and methods of forming power electronic assemblies with cooling channels and integrated electrodes
US11483951B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 26, 2019 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Sep 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B5/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming an assembly is provided. The method includes depositing a colloidal template onto a substrate, wherein the colloidal template is porous, depositing a metal layer onto and within the colloidal template, depositing a cap structure onto the colloidal template opposite of the substrate, and removing the colloidal template from between the substrate and the cap structure to form a metal inverse opal structure disposed therebetween. The method continues by depositing an electrical isolation layer in contact with the cap structure opposite the metal inverse opal structure, and attaching the electrical isolation layer to a cooling device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.