Apparatus for cutting material and system for cutting material
US11484925B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2017 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Mar 4, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21B2203/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides an apparatus for cutting a material, comprising: a frame body installed on a conveying path of a material; a cutting means, mounted on the frame body, for cutting an end portion of the material being conveyed; a laser preheating means for preheating the material by irradiating a laser beam onto the material before being conveyed to the cutting means; and a blocking and reflection means for blocking the laser beams reflected to the cutting means and re-reflecting the laser beam to the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.