Additive manufacturing apparatus utilizing combined electron beam selective melting and electron beam cutting
US11485043B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2018 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Feb 10, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An additive manufacturing apparatus utilizing combined electron beam selective melting and electron beam cutting. One electron beam emitting, focusing, and scanning device (6) is capable of emitting electron beams (67, 68) in three modes of heating, selective melting, and electron beam cutting. The electron beam in the heating mode is emitted to scan and preheat a powder bed (7). The electron beam (67) in the selective melting mode is emitted to scan and melt powder (71) in a section outline to form a section layer of a component. The electron beam (68) in the electron beam cutting mode is emitted to perform one or more cutting scans on inner and outer outlines (74, 75) of a section of the component to obtain accurate and smooth inner and outer outlines of the section. The heating, melting deposition, and outline cutting processes are repeated to obtain a required three-dimensional physical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.