Printed rigid plastic substrates
US11485127B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2017 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Apr 24, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G2215/0629
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for preparing a printed rigid plastic substrate is described, the process comprising: providing a rigid plastic substrate comprising a primer on a surface of the rigid plastic substrate, the primer comprising a primer resin; printing a liquid electrophotographic ink composition comprising a thermoplastic resin onto the primer on the surface of the rigid plastic substrate; depositing a cross-linking composition comprising a cross-linker onto the printed electrophotographic ink composition disposed on the primer; and laminating the rigid plastic substrate with a flexible film such that the ink composition and the cross-linker are disposed between the rigid substrate and the flexible film and wherein the lamination of the rigid substrate with the flexible film causes cross-linking of the thermoplastic resin of the ink composition and of the primer resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.