High-integrity opaque-inset panel envelope, and method for manufacturing the same
US11485547B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2020 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Sep 2, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D27/04
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A high-integrity opaque-inset panel envelope includes a front panel formed from a printable material, one or more apertures being defined therethrough, one or more flaps extending from the edges of the front panel, and one or more opaque inset panels/labels disposed on an inner surface of the front panel to cover the one or more apertures. Opaque inset panels can have an optical brightness about 1-6% greater than the optical brightness of the printable material. The envelope can be formed by removing portions of a printable material to form one or more flaps about a front panel and one or more apertures through the front panel and disposing one or more opaque inset panels to an inner surface of the front panel, such that the one or more opaque inset panels covers the one or more apertures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.