Micromechanical sensor

US11485630B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Jan Waldmann · Reutlingen, DE
• Rolf Scheben · Stuttgart, DE
• Rudy Eid · Stuttgart, DE

Key dates

• Filing date: Jun 6, 2019
• Grant date: Nov 1, 2022
• Expiry date: Jun 6, 2039

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P2015/0871
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.