Group 4 metal element-containing compounds, method of preparing the same, precursor compositions including the same for forming a film, and method of forming a film using the same
US11485749B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2020 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Aug 7, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/455
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
The present disclosure provides a novel Group 4 metal element-containing compound, a method of preparing the Group 4 metal element-containing compound, a precursor composition including the Group 4 metal element-containing compound for film deposition, and a method of forming a Group 4 metal element-containing film using the Group 4 metal element-containing compound. The novel Group 4 metal element-containing compound according to embodiments of the present disclosure makes it possible to form a Group 4 metal element-containing film by atomic layer deposition at a higher temperature than conventionally known Group 4 metal element-containing compounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.