Patent · US Active

Formaldehyde free adhesive composition

US11485886B2 · kind B2 · utility

0Cited by

10References

12Claims

0Family size

Assignees

DOW GLOBAL TECHNOLOGIES LLC · US
Dow Silicones Corporation · US

Inventors

Shi Pan · Shanghai, CN
Minbiao Hu · Shanghai, CN
Tong Sun · Hangzhou City, CN
Xuemei Zhai · Shanghai, CN
Shaoguang Feng · Midland, US
Yan Li · Fremont, US
Jingui Jiang · Shanghai, CN

Key dates

Filing date	Mar 7, 2019
Grant date	Nov 1, 2022
Priority date	—
Expiry date	Mar 7, 2039

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2433/00
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

A formaldehyde free adhesive composition and a plywood obtained from the adhesive composition is provided, and the plywood has a balanced performance, such as high adhesion strength, sufficient pot-life, and good workability.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.