Silicone pressure-sensitive adhesive composition
US11485888B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2018 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Sep 4, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A silicone pressure-sensitive adhesive composition is disclosed. The composition can be cured into a pressure-sensitive adhesive having a good release force against a release liner and a high peel force against several substrates. The silicone pressure-sensitive adhesive composition comprises: (A) a diorganopolysiloxane having on average at least 0.5 alkenyl groups with 2 to 12 carbon atoms per molecule; (B) an organopolysiloxane composed of R13SiO1/2 and SiO4/2 units, wherein each R1 represents a monovalent hydrocarbon group with 1 to 12 carbon atoms, having a molar ratio (R13SiO1/2 unit)/(SiO4/2 unit) of 0.6 to 1.7, and having a number average molecular weight (Mn) converted to standard polystyrene of from 1,700 to 3,000; (C) an organohydrogenpolysiloxane having on average at least two silicon-bonded hydrogen atoms per molecule; and (D) a hydrosilylation catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.