Positive-type photosensitive resin composition and cured film prepared therefrom
US11487200B2 · kind B2 · utility
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2References
11Claims
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Key dates
| Filing date | May 3, 2019 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Dec 16, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/04
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises an acrylic copolymer having a dissolution rate to a developer in a specific range and a compound containing a phenolic hydroxyl group, so that it is possible to attain a high contrast and a high sensitivity pattern when a cured film is formed. Further, it is possible to further enhance the adhesiveness of a pattern when a half-tone, as well as a full-tone, is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.