Method for preparing stacking structure, stacking structure and touch sensor
US11487393B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2020 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Sep 29, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04112
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for preparing stacking structure includes providing a substrate; disposing a metallic layer and a silver nanowire layer on the substrate; applying flexographic printing technology to print an anti-etching layer on a surface of the metallic layer or the silver nanowire layer so that the anti-etching layer partially covers the metallic layer or the silver nanowire layer; applying an etching technology to remove a part of the metallic layer or the silver nanowire layer that is not covered by the anti-etching layer and the metallic layer or the silver nanowire layer disposed therebelow with an etching liquid so that the metallic layer comprises: metallic wires; a metallic grid; and a metallic plate; and removing the anti-etching layer. A stacking structure comprises: the substrate; the metallic layer; and the silver nanowire layer. The method for preparing stacking structure and the stacking structure can be applied to a touch sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.