Electronic component and method for manufacturing the same
US11488760B2 · kind B2 · utility
1Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2018 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Feb 11, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.