Package device
US11488899B2 · kind B2 · utility
0Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2020 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Aug 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.