Ball disposition system, method of disposing a ball on a substrate and method of manufacturing semiconductor device
US11488928B2 · kind B2 · utility
0Cited by
13References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2020 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Feb 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81192
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A ball disposition system includes a ball adsorption device, and a ball guide plate providing a ball guide hole. The ball adsorption device includes an adsorption plate providing an adsorption hole extending in a first direction, and a pin extending in the first direction, a portion of the pin inserted in the adsorption hole. The ball guide plate is located beyond the adsorption plate in the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.