Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the same
US11488931B2 · kind B2 · utility
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17Claims
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Assignee
Inventors
Key dates
| Filing date | Feb 25, 2019 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Mar 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81191
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of manufacturing a semiconductor device that includes securing a lower surface of a wafer to a supporting surface of a carrier substrate formed of copper or other metal having good thermal conductance. Further semiconductor processing for packaging can include forming an RDL on the wafer, etching scribe channels through the wafer, and coating the wafer with encapsulant. After dicing, the metal carrier remains in contact with and supporting the lower surface of the wafer, and the remainder of the wafer remains coated by the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.