Modules with integrated circuits and devices

US11488943B2 · kind B2 · utility

Assignee

• X Display Company Technology Limited · IE

Inventors

• Christopher Bower · Raleigh, US
• Matthew Meitl · Durham, US
• Ronald S. Cok · Rochester, US
• Salvatore Bonafede · Chapel Hill, US
• Brook Raymond · Cary, US
• Andrew Tyler Pearson · Durham, US
• Erik Paul Vick · Raleigh, US

Key dates

• Filing date: Sep 23, 2020
• Grant date: Nov 1, 2022
• Expiry date: Dec 22, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.