Wire structure, display panel, display device with high thermal conductivity layer and manufacturing method
US11489033B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Sep 24, 2019 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Mar 31, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/131
Abstract
The present disclosure provides a wire structure for a display panel, a display panel, a display device, and a manufacturing method. The wire structure includes a first wire layer and a thermally conductive layer above the first wire layer. A thermal conductivity of the thermally conductive layer is greater than a thermal conductivity of the first wire layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.