Power control solution for reducing thermal stress on an intermittently operable chipset controlling RF application for cooking
US11490472B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2019 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Apr 21, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B40/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Control electronics may control power amplifier electronics associated with application of RF energy generated using solid state electronic components. The power amplifier electronics may be configured to control application of RF energy in an oven according to a cooking recipe at least in part based on a learning procedure that generates a power cycling between high and low powers when the learning procedure is executed. The control electronics may include processing circuitry configured to employ a thermal stress mitigation technique to control thermal stresses on the power amplifier electronics associated with the power cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.