Substrate with electronic component embedded therein
US11490503B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Mar 17, 2021 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Mar 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1469
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.