Module substrate and semiconductor module including the same
US11490509B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2021 |
| Grant date | Nov 1, 2022 |
| Priority date | — |
| Expiry date | Jun 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10159
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.