Liquid metal-based flexible electronic device and preparation method and use thereof

US11490524B2 · kind B2 · utility

Assignee

• HARBIN INSTITUTE OF TECHNOLOGY · CN

Inventors

• Liang Feng · Huai'an County, CN
• Yaming Liu · 松山镇, CN
• Huanhuan Feng · Lo Wu, CN
• Li-Ping Wang · Shanghai, CN
• Yueyue Zhang · Lo Wu, CN
• Zhenchao Zhang · Lo Wu, CN
• Min Wang · Gilbert, US
• Weiwei Zhao · Wuxi, CN
• Xing Ma · Lo Wu, CN
• Jiaheng Zhang · Lo Wu, CN

Key dates

• Filing date: Oct 28, 2021
• Grant date: Nov 1, 2022
• Expiry date: Oct 28, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1322
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Provided is a liquid metal-based flexible electronic device and a method for preparing a liquid metal-based flexible electronic device, that includes: preparing an Acrylonitrile Butadiene Styrene (ABS) plastic model; performing an ion sputtering on a surface of the ABS plastic model to form a gold film, to obtain a gold-plated ABS circuit; introducing a first silica gel into a mold to suspend the gold-plated ABS circuit inside the mold, and curing the first silica gel to obtain a cured model; immersing the cured model in acetone to dissolve the ABS model, to obtain a microchannel with a gold plating on an inner wall of the microchannel in a first silica gel substrate; and injecting a gallium-indium eutectic, inserting a copper wire, and applying a second silica gel and curing the second silica gel, to obtain the liquid metal-based flexible electronic device.