Methods and apparatuses for controlling cutting processes
US11491583B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2018 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | May 31, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/0344
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The disclosure relates to methods and apparatuses for controlling a cutting process in which a workpiece is cut by a high-energy beam. A process light signal is detected emanating from an interaction region of the high-energy beam with the workpiece in a first wavelength range (Δλ1), in which at least one metallic constituent (Fe, Cr) of the workpiece has at least one emission line, and in a second wavelength range (Δλ2), which differs from the first wavelength range, in which continuum radiation of the workpiece without emission lines is detectable. Vaporization of the at least one metallic constituent (Fe, Cr) is monitored on the basis of an intensity of the process light signal detected in the first wavelength range (Δλ1) and on the basis of an intensity of the process light signal detected in the second wavelength range (Δλ2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.