Heating of polymeric materials
US11492454B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2016 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Sep 26, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2479/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A material susceptible to dielectric heating has a base polymeric thermoplastic material (1) and a dielectric heating susceptor (2, 3) which increases susceptibility to heating by irradiation with electromagnetic, for example RF or microwave, radiation. The dielectric heating susceptor has a polymeric material (2) such as PVDF which is different from the base polymeric material and has a higher dielectric loss factor than the base polymeric material. The dielectric heating susceptor also comprises electrically polarisable entities such as carbon black dispersed within the base polymeric material without forming a conductive network. The two susceptor materials in combination with the base polymer are particularly effective together at improving susceptibility to electromagnetic radiation heating of the whole material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.