Latex composition for dip molding, a method of preparing the same, and molded article therefrom
US11492466B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2019 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | May 10, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L9/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a latex composition for dip molding. The latex composition for dip molding includes a carboxylic acid-modified nitrile-based copolymer latex and a hydrophobically modified alkali-soluble emulsion thickener, wherein the hydrophobically modified alkali-soluble emulsion thickener includes a copolymer including an associative portion and a non-associative portion, and the associative portion includes a monomer-derived repeating unit substituted by one or more first hydrophobic groups selected from the group consisting of alkyl, alkenyl, perfluoroalkyl, and carbosilyl having 8 to 15 carbon atoms, and aryl, arylalkyl, arylalkenyl, alicyclic alkyl, and polycyclic alkyl having 6 to 15 carbon atoms. A method of preparing the latex composition for dip molding, and a molded article manufactured therefrom are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.