Thermoplastic resin composition including maleimide-based heat-resistant copolymer and molded product using same
US11492481B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Dec 7, 2018 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Jun 17, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2201/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This disclosure relates to a thermoplastic resin composition comprising (A) 60 to 85 wt % of a (meth)acrylic resin, (B) 10 to 30 wt % of an acrylic graft copolymer, and (C) 5 to 10 wt % of a maleimide-based heat-resistant copolymer and a molded product using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.