Solder mask inkjet inks for manufacturing printed circuit boards
US11492509B2 · kind B2 · utility
0Cited by
6References
15Claims
0Family size
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Key dates
| Filing date | Dec 10, 2018 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Oct 10, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0736
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A radiation curable solder mask inkjet ink contains a photo-initiator, a polymerizable compound and a flame retardant wherewith a high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties and flame retardancy may be produced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.