Patent · US Active

Self-adhesive composition for the bonding of substrates with low surface energy

US11492518B2 · kind B2 · utility

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1References
14Claims
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Key dates

Filing dateOct 24, 2017
Grant dateNov 8, 2022
Priority date
Expiry dateJan 10, 2039

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2493/00
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

A hot-melt adhesive composition comprises a mixture of silylated polymers, a tackifying resin and a catalyst, in specific contents, having self-adhesive properties after crosslinking to moisture. A self-adhesive article comprises a support layer and at least one self-adhesive layer obtained after crosslinking to the moisture in the adhesive composition according to the invention. The self-adhesive article can be used to bond low-energy substrates, in particular plastic substrates, notably thermoplastic substrates having low surface energy.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.