Adhesive formulation
US11492525B2 · kind B2 · utility
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15References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2018 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Nov 8, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/312
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive composition including an epoxy-based adhesive polymer and a phosphorous element-containing compound; a process for making the adhesive composition; a process for increasing the corrosion resistance property of the adhesive composition; and a process for bonding a metal substrate with the adhesive composition to increase the corrosion resistance of the substrate by at least 40 percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.