Vacuum deposition facility and method for coating a substrate
US11492695B2 · kind B2 · utility
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4References
13Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 23, 2019 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Apr 23, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A Method for continuously depositing, on a running substrate, coatings formed from at least one metal inside a vacuum deposition facility including a vacuum chamber; a substrate coated with at least one metal on both sides of the substrate having an average thickness, wherein the coating is deposited homogenously such that the maximum thickness of the coating can exceed the average thickness of 15% maximum. A vacuum deposition facility also is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.