Microchannel heat exchanger
US11493277B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2020 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Oct 23, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2260/02
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat exchanger assembly includes a plurality of flattened heat exchanger tubes. The plurality of heat exchanger tubes include a bend that separates the plurality of heat exchanger tubes between extending in a first plane and extending in a second plane transverse to the first plane. An inlet manifold is in fluid communication with the plurality of heat exchanger tubes and includes a distribution insert at least partially extending through an inlet opening in the inlet manifold. An outlet manifold is in fluid communication with the plurality of heat exchanger tubes and includes an outlet opening spaced inward from opposing ends of the outlet manifold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.