Hybrid multi-layered optical flexible printed circuit device and manufacturing method thereof
US11493711B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2021 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Jul 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1053
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A hybrid multi-layered optical flexible printed circuit device, comprising: an optical flexible substrate including a first open window and a second open window with a first, a second surfaces opposite to each other; an intrinsic film including a first bonding region aligned with the first open window and a second bonding region aligned with the second open window formed on the first surface; an optical waveguide film including a first notch with a first slant surface aligned with the first bonding region, and a second notch with a second slant surface aligned with the second bonding region formed on the second surface and encompassed the first open window and the second open window; a first flexible printed circuit board formed on the optical waveguide film; and a first optoelectronic device and a second optoelectronic device mounted in the first bonding region and the second bonding region of the intrinsic film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.