Electronic device with crack arrest structure
US11495549B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2021 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Feb 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1003
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.