Patent · US Active

Alignment features for hybridized image sensor

US11495562B2 · kind B2 · utility

0Cited by
2References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 27, 2019
Grant dateNov 8, 2022
Priority date—
Expiry dateDec 27, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/14
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A hybridized image sensor includes a first die and a second die. The first die includes a first surface, a first plurality of conductive bumps fabricated on the first surface, and a first alignment feature fabricated on the first surface. The second die includes a second surface, a second plurality of conductive bumps fabricated on the second surface, and second alignment features fabricated on the second surface, wherein the first alignment features interact with the second alignment features to align the first plurality of conductive bumps with the second plurality of conductive bumps.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.