Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
US11495570B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2022 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Feb 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.