Methods and systems for wafer scale transducer array fabrication
US11495730B2 · kind B2 · utility
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1References
20Claims
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Key dates
| Filing date | Dec 2, 2019 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | May 5, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B2201/76
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with a second type of element, is formed by dicing a second acoustic stack. Combining the first and second comb structures may form a multi-frequency transducer array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.