Radiation hardened housekeeping slave node (RH-HKSN) application specific integrated circuit (ASIC) element
US11496133B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2021 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | Jul 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K19/00338
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Embodiments may provide a radiation hardened low-power data acquisition system-on-chip (SOC) suitable for space flight. The various embodiments may provide the radiation hardened low-power data acquisition SOC having a radiation hardened semiconductor die, a radiation hardened multiplexer integrated on the radiation hardened semiconductor die and configured to receive a plurality of analog signals and selectively output an analog signal of the plurality of analog signals, at least one radiation hardened analog to digital converted integrated on the radiation hardened semiconductor die and configured to convert the analog signal to a digital signal, and a radiation hardened serial communication interface integrated on the radiation hardened semiconductor die and configured to output the digital signal. The various embodiments may provide a computing having a processor and the radiation hardened low-power data acquisition SOC electrically coupled to the processor such that the digital signal is output to the processor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.