Microphone mounting structure for headset
US11496822B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2021 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | May 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2420/07
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a microphone mounting structure for a headset, the microphone mounting structure comprising: a housing surrounding the headset and forming an audio output channel along a vertical direction inside; a microphone mounted along the vertical direction inside a space formed by the audio output channel, and a substrate connected to a main board and including a supporting part mounted in a rear side of the microphone, wherein the microphone includes a circuit substrate formed in a rear side of the microphone, and the circuit substrate includes a hole, wherein the supporting part includes a substrate hole communicating the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.