Methods for printing conformal materials on component edges at high resolution
US11497124B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 3, 2021 |
| Grant date | Nov 8, 2022 |
| Priority date | — |
| Expiry date | May 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1366
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.