Densified wood including process for preparation
US11498240B2 · kind B2 · utility
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23References
12Claims
0Family size
Assignee
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Key dates
| Filing date | May 10, 2021 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | May 10, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B21/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wood substrate or member is included, having an increased density with respect to natural, untreated wood. The process includes drying the wood prior to application of heat and pressure, which are controlled to reduce or eliminate color change on a surface of the wood member where heat and pressure are applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.