Dip-molded article, latex composition for dip-molding and preparation method thereof
US11498245B2 · kind B2 · utility
0Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2018 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Sep 30, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2449/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a dip-molded article, and more particularly, provided are a dip-molded article including: a layer derived from a latex composition for dip-molding; and a layer derived from a polymer including a repeating unit derived from a diacetylene-based compound, a latex composition for dip-molding, and a preparation method thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.