Polyepoxidized biphenyl compounds, preparation and uses
US11499002B2 · kind B2 · utility
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Key dates
| Filing date | Nov 7, 2018 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Feb 14, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/3218
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A multi-epoxidized biphenyl compound has the formula (I) below wherein R, R1, R2 and R3 are as defined in the description, as well as mixtures of at least two of the compounds. These multi-epoxidized biphenyl compounds are fully suitable as main constituents of thermosetting epoxy resins, i.e. as polyepoxides precursors. They are beneficial substitutes for bisphenol A diglycidyl ether.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.