Fiber molding
US11499021B2 · kind B2 · utility
0Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2020 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Jul 29, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2333/12
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process for producing a thermoformable and/or -embossable fiber/polymer composite using a fibrous lignocellulosic substrate S and a polymer P, which contains
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.