Tough polyamide moulding material

US11499048B2 · kind B2 · utility

Assignee

• Evonik Specialty Chemicals (Shanghai) Co., Ltd. · CN

Inventors

• Hong Zhang · Suzhou, CN
• Jianmin Yang · Shanghai, CN
• Fei Teng · Qingdao, CN
• Zhisheng Wang · Shanghai, CN
• Yi Jhen Huang · Taipei, TW

Key dates

• Filing date: Sep 27, 2017
• Grant date: Nov 15, 2022
• Expiry date: Jan 10, 2039

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L2207/53
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A moulding material contains to an extent of at least 50 wt % of the combination of the following constituents: a) 80 to 95 parts by mass of a polyamide component comprising a1) 70 to 100 parts by wt of PA PACMX and a2) 30 to 0 parts by wt of a linear aliphatic polyamide, b) 4 to 19 parts by mass of a core-shell impact modifier, and c) 1 to 5 parts by mass of a functionalized styrene-ethylene/butylene-styrene block copolymer as an impact modifier, wherein the parts by mass of a), b) and c) sum to 100. The moulding material has a high transparency and a very good notched impact strength.