Thermal interface material, and preparation and application thereof

US11499080B2 · kind B2 · utility

Assignee

• NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING, CHINESE ACADEMY OF SCIENCES · CN

Inventors

• Wen Dai · Taichung, TW
• Zhengde Lin · Zhejiang, CN
• Nan Jiang · Zhejiang, CN
• Jinhong Yu · Zhejiang, CN
• Dan Dai · Niskayuna, US
• Hao-Cheng Hou · Hsinchu, TW

Key dates

• Filing date: May 8, 2018
• Grant date: Nov 15, 2022
• Expiry date: Jul 15, 2039

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K2201/011
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

This application describes a thermal interface material, and preparation and application thereof. Specifically, a thermal interface material is described. The thermal interface material is obtained by bending and folding, optional horizontal pressing and optional high-temperature treatment of a laminated structure. Two-dimensional high-thermal-conductivity nano-plates on the upper surface and the lower surface of the thermal interface material have a horizontal stack structure. Two-dimensional high-thermal-conductivity nano-sheets located between the upper surface and the lower surface of the thermal interface material have both a vertical stack structure and a curved stack structure. Also described are a preparation method and application of the thermal interface material. The thermal interface material combines excellent thermal conductivity and compressibility; the preparation method has the characteristics of simple process, low costs, safety and environmental protection, and accordingly, the thermal interface material can effectively resolve the heat dissipation problem of electronic products.